Previous generations of CPUs were implemented as discrete components and numerous small integrated circuits ( ICs) on one or more circuit boards. 前几代的cpu履行元件和离散化浩繁小型集成电路(ic)在一个或多个电路板。
During the assembly of semiconductor ( discrete and IC), one of major failures is from ball bonding. 在半导体(分立元件和集成电路)的封装中,一个主要失效来自于球键合工艺。